碳化硅二極管sic

	Repetitive peak reverse voltage	Average forward current	Wafer size	Chip thickness	Chip size	Top Metal Pad size	Gross Die
	Repetitive peak reverse voltage	Average forward current				Top Metal Pad size
	V	A
E15K761BJ	650	4	4″	350±20um	1.1mm*1.1mm	0.9mm*0.9mm	4729
E21K761BJ	650	10	4″	350±20um	1.84mm*1.84mm	1.6mm*1.6mm	1782
E21K2311VJ	1200	10	4″	350±20um	2.2mm*2.2mm	1.95mm*1.95mm	1300